The proposed HERMES project wants to initiate a
new mainstream packaging concept not bound by the existing supply chain, and
by large-scale manufacturing technology. The project is aiming at further
developing the concept of embedded thin chips into electronic boards, as a
base for an integrated manufacturing of electronic circuits.
The project consortium will develop a technology for embedding active and
passive components, allowing more functional integration and higher density.
The technology will be based on printed circuit board manufacturing and
assembly practice, and on standard available silicon dies, highlighting fine
pitch interconnection, high power capability and high frequency
Apart from research necessary for the technological advances towards fine
pitch, new materials, multilevel stacking, high reliability, essential
developments are needed for setting up an integrated manufacturing. Key
issues are testability of the circuits during and after manufacturing, yield
and cost of the processes, and organizing the supply chain.
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The benefits of HERMES will be very large:
- Technologically: Higher density because some "borders" (the
packaging/soldering interface) have disappeared, a smaller form factor and
even possibility for 3D stacking
- Low cost: Large-scale production will be possible, with still high
accuracy due to innovative equipment and processes (placement, LDI, etc.),
and by using "cheap" PCB processes to a large extent. Even for a smaller
number of modules to be made, the embedded component technology in a PCB
manufacturing will be interesting, by the flexibility of PCB layout, and
- Time-to-market of complex and hybrid systems: By bringing the production
and assembly of a module to one place, very short times-to-market will be
possible, especially when compared to traditional solutions with advanced
(e.g. WLP) packages (with long delivery times), and system-on-chip