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CRISP
 

 

Project Acronym HERMES
Title High density integration by embedding chips for reduced size modules and electronic systems
Start date 2008-05-01
End date 2011-04-30
Programme FP7-ICT
Description

 

The proposed HERMES project wants to initiate a new mainstream packaging concept not bound by the existing supply chain, and by large-scale manufacturing technology. The project is aiming at further developing the concept of embedded thin chips into electronic boards, as a base for an integrated manufacturing of electronic circuits.

The project consortium will develop a technology for embedding active and passive components, allowing more functional integration and higher density. The technology will be based on printed circuit board manufacturing and assembly practice, and on standard available silicon dies, highlighting fine pitch interconnection, high power capability and high frequency compatibility.

Apart from research necessary for the technological advances towards fine pitch, new materials, multilevel stacking, high reliability, essential developments are needed for setting up an integrated manufacturing. Key issues are testability of the circuits during and after manufacturing, yield and cost of the processes, and organizing the supply chain.

 

Continued below .......



The benefits of HERMES will be very large:
- Technologically: Higher density because some "borders" (the packaging/soldering interface) have disappeared, a smaller form factor and even possibility for 3D stacking
- Low cost: Large-scale production will be possible, with still high accuracy due to innovative equipment and processes (placement, LDI, etc.), and by using "cheap" PCB processes to a large extent. Even for a smaller number of modules to be made, the embedded component technology in a PCB manufacturing will be interesting, by the flexibility of PCB layout, and component placement.
- Time-to-market of complex and hybrid systems: By bringing the production and assembly of a module to one place, very short times-to-market will be possible, especially when compared to traditional solutions with advanced (e.g. WLP) packages (with long delivery times), and system-on-chip solutions.

 

Coordinator

 

 

 

AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT

FABRIKSGASSE 13
8700
LEOBEN
ÖSTERREICH

 

 

Other partners
THALES COMMUNICATIONS SA France
INFINEON TECHNOLOGIES AG Germany
ATOTECH DEUTSCHLAND GMBH Germany
ROBERT BOSCH GMBH Germany
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V Germany
CIRCUIT FOIL LUXEMBOURG SARL Luxemburg
SIEMENS AKTIENGESELLSCHAFT Germany
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW Belgium
ROOD TESTHOUSE INTERNATIONAL N.V. Netherlands

 

 


 

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