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ENCAST
 

 

Project Acronym ENCAST
Title European Network for Co-ordination of Advanced Semiconductor Technologies
Start date   2003-12-23
End date  
Programme  IST
Description
The objective of ENCAST is to organize a Network under the umbrella of a Co-ordinated Action to gather and disseminate information on semiconductor and microelectronic manufacture, assembly, pacakging and test technologies to the European electronics manufacturing industry. Typical technologies to be monitored include wafer scale packaging, 3D packaging, SiP, SOP, MCM, stacked packages, Pb-free soldering etc. This will be carried out by organizing workshops and meetings on the above technologies and disseminating the information via a regularly published newsletter and on a web site freely accessible to the semiconductor and microelectronics engineering community. Information will also be gathered and disseminated by the same method by attending other workshops, conferences, meetings, etc. worldwide.ms within a competitive amount of time.

Continued below .......



 In particular standards for the procurement and use of semiconductor die will be persued by participation in the IEC TC 47 working group producing the IEC 62258 standard, by organizing an International workshop CAST 2005, by co-ordinating with other groups such as Netpack, NEXUS-Plus, SEMI Europe, DPC and the Napa KGD workshop in the USA. Also a Die Products User Club will be formed to assist SME's in the use of these components and technologies in Europe

 

Coordinator

 

 

 

IINTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW
Business Development
kapeldreef
3001 leuven
BELGIUM
Other partners

KNOWLEDGE BASED TECHNICAL CONSULTANCY LIMITED

 UNITED KINGDOM

 SAAT TECHNOLOGY LTD

 UNITED KINGDOM

 DIE PRODUCT CONSORTIUM

 UNITED STATES

 MOTOROLA GMBH

 GERMANY

 ROBERT BOSCH GMBH

 GERMANY

 INFINEON TECHNOLOGIES AG

 GERMANY

 PHILIPS SEMICONDUCTOR AG

 SWITZERLAND

 

 


 

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